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No. STSE-CC4019A
SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED
MODEL : NFSW036T
NICHIA CORPORATION
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Nichia STSE-CC4019A 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature
Symbol IF IFP VR PD Topr Tstg Tsld
Absolute Maximum Rating 180 350 5 810 -30 ~ + 85 -40 ~ +100 Reflow Soldering : 260C Hand Soldering : 350C
(Tc=25C) Unit mA mA V mW C C for 10sec. for 3sec.
IFP Conditions : Pulse Width < 10msec. and Duty < 1/10 = =
(2) Initial Electrical/Optical Characteristics Item Symbol Condition Forward Voltage VF IF=150[mA] Reverse Current IR VR= 5[V] Rank T Iv IF=150[mA] Luminous Intensity Rank S Iv IF=150[mA]
! Luminous Intensity Measurement allowance is 10%.
Min. 6.5 4.5
Typ. 4.0 -
(Tc=25C) Max. Unit 4.5 V 50 A 9.0 cd 6.5 cd
Color Ranks x y x y 0.280 0.248 0.296 0.276 Rank a0 0.264 0.283 0.267 0.305 Rank b2 0.287 0.330 0.295 0.339 0.296 0.276 0.330 0.318 x y x y 0.287 0.295 0.330 0.318
(IF=150mA,Tc=25C) Rank b1 0.283 0.330 0.330 0.305 0.360 0.339 Rank c0 0.330 0.361 0.360 0.385 0.356 0.351
! Color Coordinates Measurement allowance is 0.01. ! One delivery will include up to two consecutive color ranks and two luminous intensity ranks of the products. The quantity-ratio of the ranks is decided by Nichia.
2.TYPICAL INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure's page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure's page. Material as follows ; Package Encapsulating Resin Electrodes : : : Ceramics Silicone Resin (with YAG Phosphor) Ag Plating
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Nichia STSE-CC4019A
4.PACKAGING
* The LEDs are packed in cardboard boxes after taping. Please refer to figure's page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number. The lot number is composed of the following characters; "#$$$$ - !% " - Year ( 3 for 2003, 4 for 2004 ) # - Month ( 1 for Jan., 9 for Sep., A for Oct., $$$$ - Nichia's Product Number ! - Ranking by Color Coordinates % - Ranking by Luminous Intensity
B for Nov. )
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Nichia STSE-CC4019A
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Temperature Cycle High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Vibration Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (Lead Solder) 0C ~ 100C 15sec. 15sec. -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. Ta=100C Ta=60C, RH=90% Ta=-40C Ta=25C, IF=150mA
Tested with Nichia standard circuit board.
!
Note 2 times
Number of Damaged 0/50
1 time over 95% 20 cycles 100 cycles 500 hrs. 500 hrs. 500 hrs. 500 hrs. 500 hrs. 300 hrs.
!
0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50
Ta=70C, IF=100mA
Tested with Nichia standard circuit board.!
60C, RH=90%, IF=150mA
Tested with Nichia standard circuit board.
Ta=-40C, IF=150mA
Tested with Nichia standard circuit board.
!
500 hrs. 48min.
JEITA ED-4701 400 403 JEITA ED-4702 JEITA ED-4702
Substrate Bending Stick
100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3direction, 4cycles 3mm, 5 1 sec. 5N, 10 1 sec.
1 time 1 time
0/50 0/50
! Thermal resistance of LED with Nichia standard circuit board : Rtj-a 110C/W (2) CRITERIA FOR JUDGING THE DAMAGE Item Symbol Test Conditions Forward Voltage VF IF=150mA Initial Level " 1.1 Reverse Current IR VR=5V Initial Level " 2.0 Luminous Intensity IV IF=150mA Initial Level " 0.7 ! The test is done after the board is cooled down enough at the room temperature. Criteria for Judgement Min. Max.
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Nichia STSE-CC4019A-1
7.CAUTIONS
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs.
(1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag with a zipper. A package of a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in the moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following condition. Baking treatment : more than 24 hours at 65 5C * Nichia LED electrode and leadframe are comprised of a silver plated. The silver surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration might lower solderability or might affect on optical characteristics. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Heat Generation * Consider the heat generation of LED when designing the circuit. The thermal resistance* Rtj-a (LED junction to ambient) is approximately 110C/W when LED is mounted on the circuit board with standard heat release approximately Rtc-a (LED package to ambient) 45C/W. It is necessary to avoid intense heat generation. Do not exceed the maximum ratings of operating temperature. * The operating current shall be decided under the condition of ambient maximum temperature of LEDs and designing the heat release. * The thermal resistance : The temperature rise of LED element when LED is turned on.
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Nichia STSE-CC4019A (4) Designing the position of LED on a board. * No twist / warp / bent / or other stress shall be applied to the board after mounting LED with solder to avoid a crack of LED package. Refer to the following recommended position and direction of LED. No good Recommended Direction
Cathode mark
Cathode mark
* Depending on the position and direction of LED, the mechanical stress on the LED package can be changed. Refer to the following figure.
E
Perforated line
A
C
D B
Slit Stress : A > B = C > D > E * Do not split board by hand. Split with exclusive special tool.
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Nichia STSE-CC4019A (5) Soldering Conditions * The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. * Recommended soldering conditions
Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200C 120 ~ 150C 120 sec. Max. 120 sec. Max. 240C Max. 260C Max. 10 sec. Max. 10 sec. Max. refer to refer to Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.) Hand Soldering Temperature Soldering time 350C Max. 3 sec. Max. (one time only)
# After reflow soldering rapid cooling should be avoided. Use the conditions shown to the under figure. [Temperature-profile (Surface of circuit board)]
<1 : Lead Solder>
2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max.
Above 200C
<2 : Lead-free Solder>
240C Max. 10sec. Max. 1 ~ 5C / sec. 1 ~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max.
Above 220C
260C Max. 10sec. Max.
2.5 ~ 5C / sec.
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
4 .5 1 .4
Use the following conditions shown in the figure.
3 .7
(Unit : mm)
* Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * When soldering, do not put stress on the LEDs during heating. (6) Cleaning * It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. * Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
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Nichia STSE-CC4019A (7) Static Electricity * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) (8) Others * Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. * The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. * Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. * The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). * User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. * The formal specifications must be exchanged and signed by both parties before large volume purchase begins. * The appearance and specifications of the product may be modified for improvement without notice.
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Nichia STSE-CC4019A
ICI Chromaticity Diagram
0.9 520 530 0.8 510 0.7 550 540
560 0.6 570 500 0.5 580 590 0.4 600
y
b1
0.3 490
c0 b2
610 620 630
a0
0.2
0.1
480 470 460 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0
x
! Color Coordinates Measurement allowance is 0.01.
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Forward Voltage vs. Forward Current
1000
Forward Current I FP (mA) Forward Current IFP (mA)
Forward Current vs. Relative Luminosity
2.5
Relative Luminosity (a.u.) Relative luminosity (a.u.)
Duty Ratio vs. Allowable Forward Current
Allowable Forward CurrentIFP (mA) Allowable Forward Current IFP (mA)
1000 Ta=25 500 350
Ta=25
Ta=25 2.0 1.5 1.0 0.5 0.0
150 100 50
180
10 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Forward Voltage VF (V)
100 1 5 10 50 100 Duty Ratio (%)
* Pulse Width 10msec.
0
100
200
300
400
500
600
Forward Current IFP (mA)
Ambient Temperature vs. Forward Voltage
5.5 IFP=150mA IFP=100mA
Ambient Temperature vs. Relative Luminosity
1.2
Relative luminosity (a.u.) Relative Luminosity (a.u.)
Ambient Temperature vs. Allowable Forward Current
Allowable Forward Current IFI (mA) Allowable Forward CurrentF (mA)
250 Rtj-a=110/W 200 180 150 100 50 0 0 20 40 60 80 100 Ambient Temperature Ta ()
Forward Voltage VF (V) Forward Voltage V (V) F
5.0 4.5 4.0 3.5 3.0 2.5 -40 -20 0 20
IFP=150mA
-9-
1.0 0.8 0.6 0.4 0.2 0.0
40
60
80
100
-40 -20
0
20
40
60
80
100
Ambient Temperature Ta ()
Ambient Temperature Ta ()
Nichia STSE-CC4019A-1
Model
NFSW036
NICHIA CORPORATION
Title No.
TYP. CHARACTERISTICS
040428426101
Forward Current vs. Chromaticity Coordinate
0.34 Ta=25 0.33 20mA 40mA 80mA 150mA 180mA 350mA
Spectrum
1.2 1.0 0.8 0.6 0.4 0.2 0.0 350 450 550 650 750 Wavelength (nm) Ta=25 IF=150mA
0.32
0.31
0.30 0.28 0.29 0.3
0.31 0.32 0.33 0.34 x
Ambient Temperature vs. Chromaticity Coordinate
0.34
Allowable Emission Intensity (a.u.) (a.u.)
y
Directivity
1.0
Allowable Luminosity (a.u.) (a.u.)
1 0.9 0.8 0.7 0.6
0 10 20
IFP=150mA 0.33 -30 0 25 50
30 40 50 60 70 80
y
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0.32 85 0.31
0.5
0.5 0.4 0.3
Ta=25 IFP=150mA 0.0 90 60 30
Radiation Angle
0.2 0.1 0
0.30 0.28 0.29 0.30 0.31 0.32 0.33 0.34 x
0
0.5
1.0
90
Nichia STSE-CC4019A
Model
NFSW036
NICHIA CORPORATION
Title No.
TYP. CHARACTERISTICS
040305400751
3 .5 2 .6 0 .8
3 .3 1 .6
3 .5
Ca thode mark
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Anode
3 .3
Ca thode
A
K
ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES
MATERIALS Ceramics Silicone Resin (with YAG Phosphor) Ag Plating
Nichia STSE-CC4019A
Model
NFSW036
Unit mm 8/1 Scale Allow 0.2
NICHIA CORPORATION
Title No.
OUTLINE DIMENSIONS
040305400761
Taping PART
0.1
Reel PART
1.75 4
0.1
1.5-0
+0.1
Cathode mark
2
0.05
0.2 3.85
0.1
0.05
180
+0 -3
15.4 +1 13-0
1
21
0.05
8 0.
5.5 +0.3 12-0.1
8
0.1
1 1.5
+0.2 -0
0.1
WHITE LED
3.85
0.1
Reel End of Tape
No LEDs
TYPE NFSW036T LOT XXXXXX- QTY pcs
LEDs mounting part No LEDs Top cover tape
13
Label
0. 2
60-0
+1
-12Pull direction Reel Lead Min.40mm (No LEDs) Embossed carrier tape Reel Lead Min.160mm (No LEDs is more than 40) Reel Lead Min.400mm
Nichia STSE-CC4019A
2,000pcs/Reel
Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes.
Model
NFSW036T
Unit mm Scale Allow
NICHIA CORPORATION
Title No.
TAPING DIMENSIONS
040305400771
Nichia STSE-CC4019A
The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed.
Reel Seal
Label
XXXX LED
TYPE LOT QTY NFSW036T xxxxxx-!! PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture Absorbent material
Moisture proof foil bag
Empty space in the box is filled With cushion material.
Label
Nichia
LED
XXXX LED
TYPE RANK QTY NFSW036T !! PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Reel/Bag Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L 1reel Dimensions (mm) 270x280x100x4t 270x280x200x4t 270x280x300x4t Quantity/Bag (pcs) 2,000 MAX. Reel/Box 4reel MAX. 10reel MAX. 16reel MAX. Quantity/Box (pcs) 8,000 MAX. 20,000 MAX. 32,000 MAX.
Model
NFSW036T
NICHIA CORPORATION
Title No.
PACKING
040305400781
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